Contamination is one of the main reasons an adhesive might not be able to bond successfully. Common types of contamination include:
How to Avoid Adhesive Failure
LEARN 4 SIMPLE TIPS TO HELP
Adhesives offer many manufacturing benefits,
Yet while today’s adhesives use advanced technology that rarely result in failure, an adhesive can still sometimes fail to bond. Take a look at four causes for adhesive failure and how to avoid them.
Ensure the equipment is properly cleaned prior to and during production. If not, adhesives can partially cure in the dispensing unit, which can reduce adhesive strength.
Properly prepare the surface before placing the adhesive. This can include washing and abrasion treatment methods based on the specific substrate and adhesive chemistry.
Improper application technique can cause an adhesive to fail, especially when applied manually.
Ensure consistent, even coverage. Too much or too little adhesive can result in bond failure.
Apply the adhesive bead in the exact same location each time for optimal bond strength.
Certain environmental conditions can increase the likelihood of adhesive failure. These include:
Conduct sufficient testing to see how the adhesive performs in different environments.
Work directly with the adhesive supplier for proper testing.
Adhesive failure can occur if the substrate and adhesive aren’t compatible. Examples include:
Be sure to verify proper preparation techniques
with substrate and adhesive manufacturers.
To avoid this, ensure the chosen adhesive technology is compatible with the surface prior to application.
- If the plastic surface has plasticizers that seep into the surface over time
- If the surface causes the adhesive to
Environmental conditions can either slow down or speed up the curing process. This can impact adhesion levels if not taken into account during the assembly process.
While adhesive failure is unlikely, it’s important to ensure steps are taken to further reduce its likelihood. For more helpful insight, check out these relevant blog posts:
Troubleshooting Common Hot Melt Adhesive and Equipment Problems
Troubleshooting Poor Substrate Adhesion and Short Open Time
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