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August 3, 2021 - Assembly

Meet Your Goals with the Right Low Pressure Molding (LPM) Process

As the electronics market continues to evolve, offering more complex products comprised of increasingly delicate parts, it’s a good idea to assess your encapsulation processes for circuit boards and cable assembly to ensure they are best suited to keep up with key needs. In particular, if you are currently using the traditional potting process, you …

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July 28, 2021 - Assembly

Bostik to Exhibit Specialty Hot Melts at Techtextil North America 2021

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, will exhibit a range of innovative bonding and sealing solutions, including its webs, films, hot melts, water-based, stitchless, membrane and powder adhesives ideal for a wide range of technical textile and nonwoven applications at this year’s Techtextil North America tradeshow at the Raleigh Convention …

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Bostik To Exhibit, Present at Adhesives & Bonding Expo

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, has announced it will exhibit a range of adhesives across industrial markets and present on adhesive selection and process tips at this year’s Adhesives & Bonding Expo in Novi, MI July 13 – 15. Offering complimentary passes to all attendees, Adhesives & Bonding …

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Bostik Strengthens Global Specialty Hot Melt Solutions Platform

Bostik, an Arkema company and global adhesive leader in the construction, consumer and industrial markets, is proud to launch its new line of high-performance, thermobonding, specialty hot melt adhesives, featuring pellets, powders, webs and films, following its recent acquisitions of Prochimir and Fixatti. Ideal for durable goods markets, including automotive, building, transfer printing and textile, …

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