Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, will present its new line of innovative instant adhesives during a panel discussion at this year’s Adhesives & Bonding Expo, March 24 – 26, 2020 in Novi, MI.
Based on methoxyethyl cyanoacrylate (MECA) technology, these instant adhesives are low blooming, low odor and more flexible compared to traditional ethyl cyanoacrylate (ECA) technology. During this presentation, Cyrielle Kolbecher, Technical Service Engineer at Bostik, will detail the key distinctions with this technology and how its capabilities enable it to outperform other options. In particular, attendees will learn the application selection criteria, handling and processing for Bostik’s instant adhesives while also discovering its benefits versus ECA solutions.
“With a deep understanding of technology gaps and market needs, we were able to formulate a new line of engineering instant adhesives designed to take product assembly to the next level,” said Cyrielle speaking in advance of her presentation. “I look forward to having the opportunity to detail the value behind this chemistry and how it addresses market needs.”
Click here to access more information about Cyrielle’s panel discussion. Be sure to visit Bostik’s booth 1331 at Foam Expo co-located with Adhesives & Bonding Expo to learn about how Bostik’s solutions can improve your manufacturing processes and end-use products overall.