Bostik to Launch Sustainable Packaging Solutions at PACK EXPO Las Vegas

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, announced it will launch new sustainable adhesive solutions at PACK EXPO Las Vegas September 23-25, 2019 in the Las Vegas, NV convention center.

The largest packaging event in North America, this year’s PACK EXPO is forecast to attract over 30,000 professionals from all verticals of the packaging industry worldwide. In addition to offering complimentary educational sessions on the evolving market trends, challenges and best practices, attendees can visit the expansive exhibit hall where more than 2,000 exhibitors will showcase their latest packaging advancements.


At the show, Bostik will introduce its latest innovation, a compostable hot melt adhesive designed to ensure packaging is fully compatible with sustainable end-of-life needs. Ideal for to-go packaging and other disposable applications, this compostable adhesive works well on high-speed packaging lines and offers high adhesion to sustainable substrates, including compostable plastics and fiberboards.

Tyler Derus, Bostik’s Converted Goods Market Manager

“With a deep understanding of how the market and consumer preferences are shifting, we wanted to give our customers a sustainable solution that would make it easier for them to address both their package manufacturing needs and consumer demands,” said Tyler Derus, Converted Goods Market Manager, who will present on this new solution at the PACK EXPO Innovation Stage. “While the development of this compostable product enables an immediate solution for sustainable packaging, we feel that it represents a platform for development into more applications as well.”

Bostik also will launch its latest addition to the Kizen® case and carton sealing adhesive product line at the show, Kizen PROS. Joining Kizen FORCE, ICE and HEAT, Kizen PROS offers enhanced performance capabilities. Yielding strong bonds to the most challenging substrates, such as highly recycled, coated or slippery materials, it also delivers an advanced level of processability over a broad temperature range, making it even easier for manufacturers to increase package output and performance.

Additionally, Bostik will feature its resealable adhesive technology, anti-fog heat seal coatings and linerless label adhesive products, all designed to reduce material waste and improve manufacturing efficiencies.

Visit Bostik’s booth LS-5846 to learn how these solutions can help address sustainability initiatives and improve product end-use performance overall.

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