Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, will present and exhibit at PACK EXPO in Las Vegas, NV September 25-27. As North America’s premier packaging event, PACK EXPO connects packaging engineers, designers, purchasers, plant managers and more, featuring product demos and educational sessions in addition to its exhibit hall.
Sponsored by PMMI, the Association for Packaging and Processing Technologies, the show brings a wide range of industries together while staying on the cutting edge of innovations. This year’s event is expected to attract over 30,000 attendees and will host more than 2,000 exhibitors in the Las Vegas Convention Center.
At the show, Bostik’s Innovation Stage presentation will feature Kizen, its latest innovative solution for end of line packaging, including case and carton sealing and tray erecting. Proud to launch this product line, deemed the next generation of hot melt adhesives, Bostik will detail how this product offers improved performance, operational efficiencies and cost savings over existing EVA and metallocene options.
Additionally, Bostik will feature smart resealable packaging solutions as well as other adhesives designed to withstand harsh shipping demands and stringent packaging application requirements.
Speaking in advance of the show, Erik Turtinen, Global Product Line Manager for Industrial Adhesives, said, “Bostik always enjoys being part of PACK EXPO, but this year is especially eventful for us. With the launch of Kizen, which revolutionizes end of line packaging, as well as our other smart resealable solutions being highlighted at the show, we look forward to speaking with industry professionals on how we can help their operations.”
To attend PACK EXPO, visit www.packexpolasvegas.com, and stop by booth #C-5644 to learn more about Bostik’s innovative packaging adhesive solutions for your company.