September 21, 2018 - Bostik News Rigid Packaging

Bostik Launches Latest Hot Melt Adhesive Solution in Kizen® Product Family

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, has announced it will launch Kizen HEAT, the latest hot melt adhesive in the Kizen product line for case and carton sealing applications, at this year’s PACK EXPO in Chicago, IL October 14-17.

Based on a water-white technology, Bostik’s newest Kizen product offers fast set speed, a broad processing window, good thermal stability and adhesion to difficult substrates. As with Bostik’s all-purpose Kizen FORCE and low temperature resistance Kizen ICE, it also improves operational efficiencies and reduces overall costs.

Kizen HEAT

However, what sets Kizen HEAT apart in the product line is its ability to withstand high temperature conditions. Ideal for hot fill applications, this new case and carton sealing solution possesses high heat resistance and can maintain performance in shipping conditions exposed to extreme temperatures. Additionally, Kizen HEAT has passed the IOPP Method T-3006 Heat Resistance Under Stress test and has been approved for use in applications of at least 160°F (71°C) for 24 hours.

“In looking at our existing Kizen product line offering, we saw an opportunity to further address case and carton sealing application needs,” said Erik Turtinen, Bostk’s Global Product Line Manager for the packaging markets. “We feel that Kizen HEAT is the perfect complement to FORCE and ICE, enabling us to fully resolve sealing challenges.”

To learn more about Kizen HEAT and the Kizen product line as a whole, visit www.bostik.com/us/kizen, or stop by Bostik’s booth E-8959 at PACK EXPO.


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