Bostik, Inc. Will Showcase Reseal Technology at PACK EXPO

Bostik has announced it will exhibit at the annual PACK EXPO, a national event for processing and packaging solutions, September 28-30 in Las Vegas, NV.

This trade show, produced by Packaging Machinery Manufacturers Institute (PMMI), expects over 30,000 visitors and 2,000 exhibitors this year. PACK EXPO is one of PMMI’s initiatives that connect participants in the processing and packing supply chain with customers around the world.

Bostik will feature environmentally friendly products at PACK EXPO as part of a sustainable packaging initiative. These include a wide-range of M-resin reseal technology for a variety of packaging requirements. M-resins are a unique adhesive that helps keep food fresher longer when used in combination with other packaging materials. It does this by being converted into part of a multi-layer film that creates resealable lidding. This technology is ideal for resealable food packaging with any thermoformed or rigid tray packaging application, including pre-sliced meats, cheese and bakery goods. M-resins can be used with any thermoformed or rigid tray packaging application, including for consumer goods, pharma or industrial markets. Because M-resin technology is resealable, it eliminates the need for secondary packaging and creates less waste.


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Bostik also will feature H1935, a hot melt product designed for exceptional performance on difficult to bond to, high recycled content board stock and lightly coated corrugate. The need for sustainable packaging solutions has lead to an increase in the amount of recycled content in corrugate board stock in case and carton sealing and forming applications. In addition to exceptional adhesion to the short corrugate fiber length and dense fibers, H1935 has a very wide temperature performance range (from -40°F to 140 °F) while maintaining its strength and flexibility. This allows products to be stored in harsh environments like freezers and/or hot shipping conditions.

In addition to the featured products, Bostik’s presence will also include its industry leading cold seal adhesives for food packaging, and Vitel® copolyester resins for a variety of food and industrial packaging applications. Bostik also will have an expanded high performance line of case and carton Metallocene hot melts.

To attend PACK EXPO, visit www.packexpolasvegas.com, and stop at Booth S-7792 to learn more about Bostik’s smart adhesive solutions.

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